Model Number : BMI160
Type : Logic ICs
Origin : China
Condition : New
Condition : New
Origin : China
Type : vibration sensor
Usage : Temperature Sensor
Theory : Resistance Sensor
Output : Switching Transducer
Supply Voltage : 1
Material : Metal
Package : SMD
Dissipation Power : 1
Model Number : BMI160
Application : 1
modname=ckeditorGY-BMI160 module (three-axis gyroscope + three-axis acceleration)Chip used: BMI160Power supply: 3-5v (internal low pressure difference voltage regulator)Communication mode: Standard IIC/SPI communication protocolChip built-in 16bit AD converter,16 bit data outputGyro range: 125 250 500 1000 2000 /sAcceleration range: 24816gMetal-sunk PCB, machine welding process to ensure qualityPin spacing 2.54mmModule size 13mm*18mm
The BMI160 is a small, low power, low noise 16-bit inertial measurement unit designed for use in mobile applications like augmented reality or indoor navigation which require highly accurate, real-time sensor data.In full operation mode, with both the accelerometer and gyroscope enabled, the current consumption is typically 950 A, enabling always-on applications in battery driven devices. It is available in a compact 14-pin 2.5 x 3.0 x 0.8 mm3 LGA package."Applications- Augmented reality and immersive gaming- 3D-scanning and indoor mapping- Indoor navigation, pedestrian dead-reckoning, step-counting- 6- and 9-axis sensor fusion, air mouse applications
The line layout is compact and regular, with good electrical insulation and mechanical stability, and can maintain stable performance under different temperature and humidity environments to ensure accuracy and reliability.
In circuit design, carefully planned lines are like precision transportation networks, and lines of different widths and spacings undertake different currents and signals transmission tasks respectively. The key signal lines are impedance matching processing, which greatly reduces signal reflection and attenuation and ensures the stable transmission of high-frequency signals.
All kinds of electronic components are soldered on the circuit board, and the solder joints are full, round, and firm and reliable. Core components like chips are perfectly connected to the circuit board through fine packaging processes to achieve high-speed data processing and interaction.
This circuit board has a wide range of responses in many fields. Whether in the industrial control field that requires extremely high stability or consumer electronics field that pursues extreme performance, it can provide solid guarantees for the stable operation of the equipment with its excellent design and reliable performance, and help various electronic devices play a powerful role.
